Solder paste for SMD KOKI 40g

Description:

Solder paste for SMD KOKI 40g. High quality surface mount solder paste for manual or automatic dispensing. Blend of metal (Sn-Pb-Ag) powders, RMA flux on resin base, solvent, activators removing the oxides from soldered surfaces and tixotropic additions, that give to the paste required viscosity and plasticity.

Chloride free.

Flux residues are non-corosive and have excellent electrical and chemical properties. The PCB after soldering needs no cleaning. Available in 10 ml syringes.

How to use solder paste:

You must put portion of paste into area of soldering then make positioning of SMD chip. When all is ready just use hot air station to change paste into solder wax.

To use it with BGA you must apply small portion of solder paste into pointing kit and then use hot air station to make ball on BGA chips.

Composition: tin (62%), lead (36%) and silver (2%)

Manufacturer: KOKI, (Japan).

Wrapping:  Syringe 10 ml / 40 g

Quality: SUPER

More informations:

• Guarantee agreement
• Weight: 0.05 Kg.
• Product addedd::

Shipment:

Shipment calculator: http://polphone.com/u/shiping_calculator.php

Payments details:

details for Bank Transfer T/T

Reciver details:
KORJAR, Jaroslaw Piotrowski
street: Chrobrego 51
post code: 58-300
City: Walbrzych
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244

Bank details:
BRE BANK S.A. (FORMERLY BANK ROZWOJU EKSPORTU S.A.)
RETAIL BANKING
City: Łódź,
post code: 90-050
street: Al. Mickiewicza 10
SWIFT: BREXPLPWMUL
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244  zamien na:
USD: PL68 1140 2017 0000 4212 0028 2244
EUR: PL41 1140 2017 0000 4012 0032 2404