BGA Planting for Siemens x65, x7x
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Description:
Stainless BGA Planting Kit for Siemens series x65, x7x Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.List of supported phones:
- A70, A75, AX75
- C75, CX75, M75
- Siemens CX70
- Siemens X65 - np. A65, C65, CV65, CT65, CF65, CX6C, CX65, CXV65, S65, SV65, SL65, M65, MV65
- and similar...
In set:
- Planting plate for x65, x7x series
More informations:
- Guarantee agreement
- Weight: 0.01 Kg.
- Product addedd::
Shipment:
Shipment calculator: http://polphone.com/u/shiping_calculator.php
Payments details:
details for Bank Transfer T/T
Reciver details:
KORJAR, Jaroslaw Piotrowski
street: Chrobrego 51
post code: 58-300
City: Walbrzych
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244
Bank details:
BRE BANK S.A. (FORMERLY BANK ROZWOJU EKSPORTU S.A.)
RETAIL BANKING
City: Łódź,
post code: 90-050
street: Al. Mickiewicza 10
SWIFT: BREXPLPWMUL
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244 zamien na:
USD: PL68 1140 2017 0000 4212 0028 2244
EUR: PL41 1140 2017 0000 4012 0032 2404
Payments methods:
Downloads:
- No additional files.
