BGA Planting Kit A - B
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Description:
Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, MotorolaStainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone.
This set can work with 6 different chips. Description of each chip is in manual.
List of supported chips:
- Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar...
- CPU do SE T230, T610, T630 and similar...
- Dialog do Siemensow serii x65 and similar...
- CPU Siemens C55, C60, MC60 and similar...
- UEM in Nokia phones
- CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar...
- and more (see all chips in manual link)
In set:
- Planting plate
- Description
More informations:
- Guarantee agreement
- Weight: 0.01 Kg.
- Product addedd::
Shipment:
Shipment calculator: http://polphone.com/u/shiping_calculator.php
Payments details:
details for Bank Transfer T/T
Reciver details:
KORJAR, Jaroslaw Piotrowski
street: Chrobrego 51
post code: 58-300
City: Walbrzych
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244
Bank details:
BRE BANK S.A. (FORMERLY BANK ROZWOJU EKSPORTU S.A.)
RETAIL BANKING
City: Łódź,
post code: 90-050
street: Al. Mickiewicza 10
SWIFT: BREXPLPWMUL
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244 zamien na:
USD: PL68 1140 2017 0000 4212 0028 2244
EUR: PL41 1140 2017 0000 4012 0032 2404
Payments methods:
Downloads:
- No additional files.
