BGA IC Adhesive removing liquid

Description:

BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection and safest. It has good permeability; it can quickly soften and loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn not to harm to circuit board and component, even to maintaince worker.

Example of use with unlocking
http://es.youtube.com/watch?v=xOPLgYqBVx8

More informations:

• Guarantee agreement
• Weight: 0.2 Kg.
• Product addedd::

Shipment:

Shipment calculator: http://polphone.com/u/shiping_calculator.php

Payments details:

details for Bank Transfer T/T

Reciver details:
KORJAR, Jaroslaw Piotrowski
street: Chrobrego 51
post code: 58-300
City: Walbrzych
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244

Bank details:
BRE BANK S.A. (FORMERLY BANK ROZWOJU EKSPORTU S.A.)
RETAIL BANKING
City: Łódź,
post code: 90-050
street: Al. Mickiewicza 10
SWIFT: BREXPLPWMUL
Country: Poland
Account: 68 1140 2017 0000 4212 0028 2244  zamien na:
USD: PL68 1140 2017 0000 4212 0028 2244
EUR: PL41 1140 2017 0000 4012 0032 2404