BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones. The ingredients of it is newestly, environmental protection and safest. It has good permeability; it can quickly soften and loosens solidified resin advesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon. It doesn not to harm to circuit board and component, even to maintaince worker. Example of use with unlocking http://es.youtube.com/watch?v=xOPLgYqBVx8

Stainless BGA Planting Kit for Nokia, Siemens, SonyEricsson, Samsung, Motorola Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. This set can work with 6 different chips. Description of each chip is in manual. List of supported chips: Flash Nokia 6610, 6610i, 7250, 3510, 3510i and similar... CPU do SE T230, T610, T630 and similar... Dialog do Siemensow serii x65 and similar... CPU Siemens C55, C60, MC60 and similar... UEM in Nokia phones CPU Nokia 7650, SonyEricsson K700, K500, K300 and similar... and more (see all chips in manual link) In set: Planting plate Description

Stainless BGA Planting Kit for Siemens series x65, x7x Stainless Planting Kit for making IC Tin ball is needed tool when you have to exchange BGA parts of your phone. List of supported phones: A70, A75, AX75 C75, CX75, M75 Siemens CX70 Siemens X65 - np. A65, C65, CV65, CT65, CF65, CX6C, CX65, CXV65, S65, SV65, SL65, M65, MV65 and similar... In set: Planting plate for x65, x7x series

Hakko Soldering Paste. High quality, acid free soldering paste. Manufacturer: HAKKO (Japan). Wrapping: 10g Quality: Super

BGA Planting Kit.  Practical and necessary planting kit for BGA rework. Each proffesional GSM service should have this set. Additionally in this set You may find special holder (for phone board) and practical feeder with solder paste. This set is necessary to star BGA rework. Full data sheet is below under "Manual" link.

RF 800 (RF800) SMD/BGA FLUX Description: Necessary when repairing damaged BGA balls, soldering BGA chips in mobile phones Necessary for SMD repairs Featured dropper allow precisely measure flux No need cleaning after operation Import: Germany Wrapping: 10 ml Quality: Very good

Aoyue 638 - board inspection system. Aoyue 638 is a device allowing the inspection of motherboards. With an integrated camera with a lens with variable magnification and a maximum of approximately 100x you can see exactly even the smallest connection between the pins of integrated circuits, as well as the state of soldering BGA chips. The handle is attached with 7 "TFT color monitor on which you can easily see the place of inspection, the platform features a curved LED lamp illuminates the place of the inspection arm. Features and Functions Colour CCD camera Variable-magnification lens, the maximum magnification: 100x. Color LCD Monitor Convenient platform to handle. Stable mount the camera and screen. Adjustable camera for different magnifications. Integrated source of light. Handle the basis of the maximum unfolded 22x30 cm Includes - A platform to handle - monitor 7 "TFT-mount - Camera with lens with variable magnification - AC 220V - Manual - Warranty 12 months

BGA SOLDER FLUX RMA-223 Description: Necessary when repairing damaged BGA balls, soldering BGA chips in mobile phones Wrapping - squirt 10ml Necessary for SMD repairs

Soldering Paste CT-61C The soldering paste is an essential tool during heating process for soldering work. - Joint hight intensity - Good immersion - Neutral PH7 +/- 0.3 - No poison, no corrosion - Good insulation - Smooth welding surface - No deterioration, no dry Wrapping capacity: 10g

BGA Soldering Balls Size: 0.5 mm Quantity: 10 000 pieces Depend on stock You can receive different wrapping type but the product quantity will be the same also quality will be the same.

BGA Soldering Balls Size: 0.3 mm Quantiety: 10 000 pieces Depend on stock You can receive different wrapping type but the product quantity will be the same also quality will be the same.

Lead-free soldering paste in 50 grams packaging.

This Soldering paste Weller should be basic equipment in every electro service. One of the most popular soldering equipment can be used for simple and proffessional operations. Quality of Weller company (Germany). Basic features: - Flux type: F-SW21 - Shape: paste - Weight: 20 g - Features: can be washed down with alcohol based agents - Applications: electrotechnics - RoHS In set: Soldering paste Weller 20g

BGA reballing stencils JV-RMS set of 12 pcs. universal BGA rework stencils for repair of most of the IC types, pitch, sizes, ball matrix and patterns. Technical Specifications: - pitch: 0.6, 30x30, T=0.2 - pitch: 0.5, 30x30, T=0.2 - pitch: 0.5, 30x30, T=0.15 - pitch: 0.7, 30x30, T=0.2 - pitch: 0.8, 30x30, T=0.25 - pitch: 0.8, 20x20, T=0.25 - pitch: 1.0, 40x40, T=0.25 - pitch: 1.27, 40x40, T=0.25 - pitch: 1.0, 30x30, T=0.25 - pitch: 1.0, 20x20, T=0.25 - pitch: 1.27, 30x30, T=0.25 - pitch: 1.5, 30x30, T=0.25 Package contains: - 2 stencils 40×40 - 8 stencils 30×30 - 2 stencils 20×20

Soldering paste (for BGA hot air reballing etc.) Wrapping 20g Harmful by inhalation and if swallowed Danger of cumulative effects Keep away from food, drink and animal food Don't drink, eat or smoke when using Avoid prolonged or repeated contact of any skin with solder paste In case of ingestion contact doctor immediately Store container well closed and in cool place (0 to 15 C)

Desoldering Braid (Wick) 1,5mm Copper braids moisten with solder adhesive flux. Very good thermal conductivity. Suitable for desoldering overheat sensitive devices and for cleaning PCB's tracks.

Aoyue Soldering Paste W001 . Cheaper alternative for best quality "Koki" paste. Features: - Solder paste with lead additives - Capacity 50 grams - For BGA balls rework Replacement for Koki paste.

Solder paste for SMD KOKI 40g. High quality surface mount solder paste for manual or automatic dispensing. Blend of metal (Sn-Pb-Ag) powders, RMA flux on resin base, solvent, activators removing the oxides from soldered surfaces and tixotropic additions, that give to the paste required viscosity and plasticity. Chloride free. Flux residues are non-corosive and have excellent electrical and chemical properties. The PCB after soldering needs no cleaning. Available in 10 ml syringes. How to use solder paste: You must put portion of paste into area of soldering then make positioning of SMD chip. When all is ready just use hot air station to change paste into solder wax. To use it with BGA you must apply small portion of solder paste into pointing kit and then use hot air station to make ball on BGA chips. Composition: tin (62%), lead (36%) and silver (2%) Manufacturer: KOKI, (Japan). Wrapping:   Syringe 10 ml / 40 g Quality: SUPER

Active Rosin 35g. Adipic acid (2,5%) activated colophony. No cleaning is needed after soldering because the acid is "bounded" in set colophony. The colophony exhales nice pine fragrance. Weight [g] - 35 Wrapping: metal container. Manufacturer: AG Chemia

SMD Soldering Paste No Clean 96,5Sn/3Ag . Paste designed for soldering SMD components in production processes that dont include washing phase, It`s based on 'no clean' flux type that does not require cleaning and it`s residues dont couse corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose it`s physical and chemical properties even after being left 20 hours on the PCB. Pb free. Features: In set: Paste in syringe 8g